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Datasheet File OCR Text: |
headquarters riverside ca www.bourns.com page 1 of 1 casrn: cas registry number is a registered trademark of the american chemical society material declaration sheet no. construction element(subpart) homogeneous material material weight [ mg ] homogeneous material \ substances casrn if applicable materials mass % material mass % of total unit wt. subpart mass of total wt. (%) 1 s emiconductor device silicon chip 3.75 doped silicon 7440 - 21 - 3 100 4.2 4 .2 copper 7440 - 50 - 8 95.645 44.41 iron 7439 - 89 - 6 2.185 1.01 tin 7440 - 31 - 5 0.034 0.02 zinc 7440 - 66 - 6 0.135 0.06 2 lead frame copper alloy with silver plating 41.48 silver (plating) 7440 - 22 - 4 2.0 0.9 3 46.43 3 bond wire gold wire 0 .43 gold 7440 - 57 - 5 100 0.48 0.48 di - ester resin proprietary 3 0.03 functionalized ester proprietary 7 0.06 polymeric compound proprietary 3 0.03 4 die attach adhesive 0.79 silver 7440 - 22 - 4 87 0.76 0.88 silica fused 60676 - 86 - 0 90.5 40.63 epoxy resin proprietary 4.7 2.11 phenolic resin proprietary 4.7 2.11 5 mold compound (halogen - free) epoxy resin 40.11 carbon black 1333 - 86 - 4 0.1 0.05 44.9 6 matte tin plating matte tin 2.78 tin 7440 - 31 - 5 100 3.11 3.11 total weigh t 89.34 this document was updated on: january 12, 2010 important remarks: 1. it is the responsibility of the user to verify they are accessing the latest version. material number p850 - g120 - wh product line tbu compliance date january - 2008 rohs compliant yes msl 3
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